CENTRE FOR NANO SCIENCE AND ENGINEERING
CENTRE FOR NANO SCIENCE AND ENGINEERING
CENTRE FOR NANO SCIENCE AND ENGINEERING
CENTRE FOR NANO SCIENCE AND ENGINEERING
CeNSE OVERVIEW
The Centre for Nano Science and Engineering (CeNSE) was established in 2010 to pursue interdisciplinary research across several disciplines with a focus on nanoscale systems. Current research topics include, but are not limited to nanoelectronics, MEMS/NEMS, microfluidics, nanomaterials and devices, photonics, nano-biotechnology, solar cells, neuro-biology, quantum and neuromorphic computing, sensors, devices, thin-films, and optoelectronics.
The centre offers M.Tech and PhD programs in a wide range of areas and has close interactions with the industry. It houses a 14000 sq. ft. state-of-the art nanofabrication and clean room facility (NNFC). It also houses a comprehensive micro nano characterization facility (MNCF). Device packaging, integration and system development is supported by the Systems and Packaging Facility (S&PF). The in-house technology business incubator, INCeNSE proudly incubates 6 start-ups today, with access to the best-in-class infrastructure, labs, and mentoring support.
EVENTS &
ANNOUNCEMENTS
For Students
What we offer
National Facilities
Research
Where is the electricity flowing?
Multichannel conduction in electron transport dynamics of three dimensional topological insulators
What if gas sensors didn’t need power?
Can One Material Detect Two Gases at Once—Without Power?
What Happens when a droplet hits a sieve?
Researchers from Microfluidic Devices & Heterogeneous Systems Lab have discovered a novel recoil cavity mechanism that enables precise single-droplet generation during liquid impact on superhydrophobic sieves.
What secrets lie beneath suspended graphene?
New insights into graphene–liquid interactions!
Unlocking Carrier Mobility in Perovskites
Measuring charge carrier mobility in resistive perovskites has long posed a challenge.
Energy-efficient, high-performance neuromorphic hardware
A collaborative effort between CeNSE, IISc, and IIT Kanpur results in the development of lead-free Cs₃Bi₂I₉ perovskite memristors that mimic brain-like synapses—bringing us closer to next-gen, low-power neuromorphic computing.
Elevating Helicopter Safety: Innovative Absolute Pressure Transducer for Precise Altitude Data Recording
Absolute pressure transducer developed by Prof. M M Nayak and Mr. Krishna Prasad is connected to Pitot-static system of the helicopter for sensing the pressure at static port. Read more…
CeNSpire: Breathing New Life into Healthcare with a Portable Low-Cost Ventilator
CeNSpire ventilator with 7 modes of operation was developed by a team of students, engineers and professors led by Prof. Sushobhan Avasthi.
Read more…
Packaging power: need for power semiconductor device packaging in the industry
Power devices usually handle much larger currents and voltages such that they require larger interconnections and more efficient thermal management. Read more…
Compact gas sensors
Professor Navakanta Bhat and Krishna Prasad have developed gas sensors designed for detecting leaks of various gases commonly used in industries. Read more…
‘Ocean’ CVD Reactor: A Revolutionary Tool for Low-Dimensional Material Synthesis
An Ocean CVD reactor was developed by KAS Technologies in collaboration with Prof. Srinivasan Raghavan at the Centre for Nano Science and Engineering, Indian Institute of Science. Read more…
Real-Time Air Quality Monitoring with Nanosensors and AI Insights
The Realtime Airquality Monitoring System updates on a Real Time basis the Data of CO, CO2, SO2, NO2 Sensors along with Ambient RH & Temp. Read more…
CeNSE FACILITIES
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National Nanofabrication (NNfC)National Nanofabrication Centre consisting of a comprehensive 14,000 sq. ft. clean-room facility with capability for: |
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Micro and Nano Characterization Facility (MNCF)The one of its kind micro and nano characterization facility (MNCF) aims to be a single shop for all a characterization needs of any nanofabrication process. It is rare to find such a comprehensive array of tools under a single roof, anywhere in the world. Read more… |
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PACKAGINGIC Packaging facility has the complete capability to convert a wafer into a packaged device – from wafer sawing to wire bonding to precision welding. In addition, there are dedicated setups for pneumatic/hydraulic pressure calibration for pressure sensors and acoustic calibration for acoustic sensors. Read more… |