RA-advpackage

Position: Research Associate- Advanced heterogeneous packaging

Qualification: Ph.D.

Salary: maximum: 58,000.00 + 27 %HRA

Job location: Center for Nano Science and Engineering, Indian Institute of Science Bangalore.

Last date for application: 21st April 2024

Application link: https://forms.gle/kiYKDHtqdNJFSMvj9

 

Key responsibilities but not limited to.

  1. Develop an advanced heterogeneous chip-to-chip integration process.

  2. Develop design rules for chiplet packaging.

  3. Develop hybrid substrate technology for electronic-photonics integration

  4. Develop flip-chip transfer technology.

  5. Develop structural and functional testing and qualification.

 

Required and desirable skills:

  • Hands-on experience in packaging processes.

  • Knowledge of die-bonding, wire bonding and flip-chip.
  • Analytic problem-solving.
  • Documentation preparation and reporting.
  • Relevant experience in any of the above mentioned areas.
  • Excellent communication skills, oral and written.